MEP EP#281: Through Hole Manufacturing

<h4><a href="https://macrofab.com/blog/mep-ep281-through-hole-manufacturing">MEP EP#281: Through Hole Manufacturing</a><br></h4><p>Through Hole Manufacturing</p> <ul> <li>Processes <ul> <li>Hand Soldering</li> <li>Soldering “robot”</li> <li>Wave soldering <ul> <li>Design Criteria</li> <li>Pallets</li> </ul> </li> <li>Selective soldering <ul> <li>Design Criteria</li> <li>Keepouts</li> </ul> </li> </ul> </li> <li>Lead Forming <ul> <li>Pre purchase?</li> <li>Forming with a die?</li> <li>Using hand tools?</li> </ul> </li> <li>PCB design <ul> <li>Holes</li> <li>Non circular?</li> <li>Annular rings</li> <li><a href="https://www.pcb-3d.com/tutorials/how-to-calculate-pth-hole-and-pad-diameter-sizes-according-to-ipc-7251-ipc-2222-and-ipc-2221-standards/" target="_blank" rel="noopener">IPC stuff</a> <ul> <li>IPC-2221 Generic Standard on Printed Board Design</li> <li>IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards</li> <li>IPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards</li> <li>IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard <ul> <li>Performance Classification (1,2,3)</li> <li>Producibility Levels (A,B,C)</li> <li>Land Pattern Determination (Density level A,B,C)</li> </ul> </li> </ul> </li> </ul> </li> </ul>